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High-speed XYZ Glue unit - NXP ITEC
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A high-speed XYZ manipulator was designed and built to print glue lines for semiconductor die bonding.
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A new technology in the semiconductor industry is to glue IC components to lead frames. To apply the glue accurately a high precision XYZ manipulator is needed. A new concept is developed with the aid of predictive modeling. MI-Partners has manufactured, assembled and tested the first OEM modules. |
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Challenges |
- High-speed X Y Z positioning module with high accuracy
- Proto phase skipped by means of predictive modeling. The first module is the first of the production series with all the robustness and lifetime requirements
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Key Competences |
- Predictive modeling (mode shapes in control loop)
- Concept design
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Results |
- A High-speed XYZ Glue unit with:
- working area of 8 x 8 x 8 mm3
- accuracy of 5 µm
- accelerations of 50 m/s2
- controller implemented on NXP’s FlexDMC drive
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Cooperation |
- NXP ITEC (Specifications and reviews)
- Renishaw/Lasertec (development xy-sensor)
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