Other Projects


G-force test gantry
Polymer damper
→ High-speed XYZ Glue unit
Nano precision X-Y-Rz stage
Actuator Test Rig
Through-wall maglev stage
Active Vibration Isolation
Gantry stage fair demonstrator
Force cancellation demonstrator
Glass test setup
Assembly tool
Seismic Vibrator
Hybrid Actuator
Automatic Bookstack Unloader
Over Actuated Demonstrator
Trailer design
Diffractive element tester
SCIL® nano-imprint module

High-speed XYZ Glue unit - NXP ITEC

A high-speed XYZ manipulator was designed and built to print glue lines for semiconductor die bonding.

A new technology in the semiconductor industry is to glue IC components to lead frames. To apply the glue accurately a high precision XYZ manipulator is needed. A new concept is developed with the aid of predictive modeling. MI-Partners has manufactured, assembled and tested the first OEM modules.

Challenges
  • High-speed X Y Z positioning module with high accuracy
  • Proto phase skipped by means of predictive modeling. The first module is the first of the production series with all the robustness and lifetime requirements
Key Competences
  • Predictive modeling (mode shapes in control loop)
  • Concept design
Results
  • A High-speed XYZ Glue unit with:
  • working area of 8 x 8 x 8 mm3
  • accuracy of 5 µm
  • accelerations of 50 m/s2
  • controller implemented on NXP’s FlexDMC drive
Cooperation
  • NXP ITEC (Specifications and reviews)
  • Renishaw/Lasertec (development xy-sensor)