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Over Actuated Demonstrator - Internal research
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For a lightweight 450mm wafer chuck a set-up was designed and built to test smart actuator placement.
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In semiconductor industry throughput is increased to reduce the costs per die, e.g. by increasing wafer diameter from 300 to 450 mm. A big disadvantage of larger wafers is larger, and thus, heavier (means slower) wafer stages. The conservative approach of a light and stiff chuck must be replaced by a lighter, but also, flexible chuck. By using an optimized mechanical structure and smart actuator placement several eigenmodes will not be excited. This set-up shows that by using smart actuator placement bandwidths of 200 Hz at 7 kg stage mass (for 450mm) can be obtained. This shows that the same performance can be obtained for a 450mm stage as with current 300mm stages. |
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Challenges: |
- Realization of a light and flexible 450mm wafer stage with no additional sensors and control complexity
- Stage design with predictable mode shapes
- Seperate frame vibrations from stage dynamics
- Mechanical decoupling to apply 3x SISO control on 4 actuators for 3 DOF
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Key Competences: |
- Predictive modeling on mode shapes
- Concepts for dynamic decoupling of frame vibrations
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Results: |
- Rubber membranes in actuator suspension to prevent excitation of base frame (replacement of force frame)
- New actuator design
- Controller implemented on industrial NYCE4000
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Cooperation: |
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