High-speed XYZ Glue unit
NXP ITEC
A high-speed XYZ manipulator was designed and built to print glue lines for semiconductor die bonding.
A new technology in the semiconductor industry is to glue IC components to lead frames. To apply the glue accurately a high precision XYZ manipulator is needed. A new concept is developed with the aid of predictive modeling. MI-Partners has manufactured, assembled and tested the first OEM modules.
Challenges
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High-speed X Y Z positioning module with high accuracy
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Proto phase skipped by means of predictive modeling. The first module is the first of the production series with all the robustness and lifetime requirement
Key Competences
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Predictive modeling (mode shapes in control loop)
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Concept design
Results
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A High-speed XYZ Glue unit with:
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working area of 8 x 8 x 8 mm3
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accuracy of 5 µm
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accelerations of 50 m/s2
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controller implemented on NXP’s FlexDMC drive
Cooperation
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NXP ITEC (Specifications and reviews)
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Renishaw/Lasertec (development xy-sensor)